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Integrated Circuit Packaging Types

  • Land Grid Array (LGA)
    • Opposite of a PGA i.e. Pins protrude from the motherboard, and the IC has pin holes
    • Pros
      • Not prone to damage
  • Pin Grid Array (PGA)
    • Use pins to make connections
    • Types
      • Ceramic PGA (CPGA)
      • Plastic PGA (PPGA)
      • Staggered PGA (SPGA)
      • Flip-Chip PGA (FCPGA)
  • Ball Grid Array (BGA)
    • Use solder balls to make connections
    • Pros
      • Can be reballed
      • Easy to desolder
    • Cons
      • Hard to repair, because solder joints can only be checked by X-Rays
      • Only usable in multi-layer PCBs

  • Ceramic Column Grid Arrays (CCGA)

    • Used in military and space applications due to extreme reliability
    • Not used in consumer applications due to restrictions by RoHS in the EU

  • System-in-Package (SiP) / 3D IC (stacked)

  • Package-on-Package (PoP)
  • Multi Chip Module (MCM)
  • Network on a Chip

NOTE: JEDEC sets standards for packaging formats

  • Through Hole Technology
  • Surface Mount Technology
    • e.g. BGA
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